IEC 60317-20 Ed. 3.1 b:2019

Current Revision

Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155

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IEC 60317-20 Ed. 3.1 b:2019

Name: IEC 60317-20 Ed. 3.1 b:2019 – Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155
Brand: International Electrotechnical Commission
SKU: IEC 60317-20 Ed. 3.1 b:2019
Price: 107.03 USD
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Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155

PUBLISH DATE 2019

PAGES 46

Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155

IEC 60317-20:2013+A1:2019 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a sole coating based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements.

NOTE: A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics.

The range of nominal conductor diameters covered by this standard is:

Grade 1: 0,018 mm up to and including 0,800 mm;
Grade 2: 0,020 mm up to and including 0,800 mm.

The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2013.

This third edition cancels and replaces the second edition published in 1990, Amendment 1:1997 and Amendment 2:1999. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous edition:

new 3.2.2 containing general notes on winding wire, formerly a part of the scope;
revision to references to IEC 60317-0-1:2013 to clarify that their application is normative;
modification to Clause 15 to remove specific wire specimen sizes;
consolidation of 17.1 and 17.2 of the solderability requirements;
modification to Clause 19, Dielectric dissipation factor;
new Clause 23, Pin hole test.

This consolidated version consists of the third edition (2013) and its amendment 1 (2019). Therefore, no need to order amendment in addition to this publication.

Key words: requirements of solderable enamelled round copper winding wire, class 155, sole coating based on polyurethane resin