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IEC 60749-29 Ed. 2.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
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IEC 60749-29 Ed. 2.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

PUBLISH DATE 2011
PAGES 52
IEC 60749-29 Ed. 2.0 b:2011
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 60749-29:2011 covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is toestablish a method for determining integrated circuit (IC) latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing "no trouble found" (NTF) and "electrical overstress" (EOS) failures due to latch-up. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect to the previous edition include:
- a number of minor technical changes;
- the addition of two new annexes covering the testing of special pins and temperature calculations.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date April 1, 2011
Language b - English & French
Page Count
Revision Level 2.0
Supercedes
Committee 47
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