IEC 61076-8-107 Ed. 1.0 b:2023

Current Revision

Connectors for electrical and electronic equipment - Product requirements - Part 8-107: Power connectors - Detail specification for 2P 200 A, 1 000 V plus 2P 5 A 50 V rectangular housing shielded connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated

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IEC 61076-8-107 Ed. 1.0 b:2023

Name: IEC 61076-8-107 Ed. 1.0 b:2023 – Connectors for electrical and electronic equipment - Product requirements - Part 8-107: Power connectors - Detail specification for 2P 200 A, 1 000 V plus 2P 5 A 50 V rectangular housing shielded connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated
Brand: International Electrotechnical Commission
SKU: IEC 61076-8-107 Ed. 1.0 b:2023
Price: 328.79 USD
Availability: InStock

Connectors for electrical and electronic equipment - Product requirements - Part 8-107: Power connectors - Detail specification for 2P 200 A, 1 000 V plus 2P 5 A 50 V rectangular housing shielded connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated

PUBLISH DATE 2023

PAGES 80

Connectors for electrical and electronic equipment - Product requirements - Part 8-107: Power connectors - Detail specification for 2P 200 A, 1 000 V plus 2P 5 A 50 V rectangular housing shielded connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated.

IEC 61076-8-107:2023 describes free and fixed rectangular connectors with:

2P power plus 2P signal contacts;
plastic housing with locking lever and four possible codings;
200 A rated current, 1 000 V DC rated voltage on the power section;
5 A rated current, 50 V DC rated voltage on the signal section;
individual shielding around each power contact with relevant shielding termination;
IP65/IP68 degree of protection when mated and locked, and IPXXB on both plug and receptacle parts when unmated;

hereinafter referred to as a connector, for use in electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods.