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IEC 61163-1 Ed. 2.0 b:2006

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
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IEC 61163-1 Ed. 2.0 b:2006

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

PUBLISH DATE 2006
PAGES 170
IEC 61163-1 Ed. 2.0 b:2006
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots
This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61163
Publication Date June 1, 2006
Language b - English & French
Page Count 170
Revision Level 2.0
Supercedes
Committee 56
Publish Date Document Id Type View
June 1, 2006 IEC 61163-1 Ed. 2.0 b:2006 Revision
June 1, 2006 Revision