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IEC 61189-2-801 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
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International Electrotechnical Commission Logo

IEC 61189-2-801 Ed. 1.0 b:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

PUBLISH DATE 2024
IEC 61189-2-801 Ed. 1.0 b:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date June 5, 2024
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
June 5, 2024 Revision
June 5, 2024 IEC 61189-2-801 Ed. 1.0 b:2023 Revision