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IEC 61189-5-4 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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IEC 61189-5-4 Ed. 1.0 b:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

PUBLISH DATE 2015
PAGES 50
IEC 61189-5-4 Ed. 1.0 b:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods for solder alloys, fluxed and non-fluxed solid wire, and for lead free soldering.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date Jan. 8, 2015
Language b - English & French
Page Count 50
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
Jan. 8, 2015 IEC 61189-5-4 Ed. 1.0 b:2015 Revision
Jan. 8, 2015 Revision