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Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad.
IEC 61249-2-33:2009 specifies requirements for properties of non-halogenated modified epoxy woven E-glass laminate sheet of a thickness of 0.05 mm up to 3.2 mm, of defined flammability (vertical burning test), copper-clad.
The glass transition temperature is defined to be 150 ¦C minimum.
The relative permittivity is equal to or less than 4.1 and the dissipation factor is equal to or less than 0.0120 at 1 GHz.
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