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IEC 61249-8-8 Ed. 1.0 b:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
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IEC 61249-8-8 Ed. 1.0 b:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

PUBLISH DATE 1997
PAGES 30
IEC 61249-8-8 Ed. 1.0 b:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61249
Publication Date June 1, 1997
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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