IEC 62047-10 Ed. 1.0 b:2011

Current Revision
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PUBLISH DATE 2011
PAGES 26

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.

This standard is applicable to metallic, ceramic, and polymeric materials.

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