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IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
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IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PUBLISH DATE 2026
PAGES 26
IEC 62047-10 Ed. 1.0 b:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date April 1, 2026
Language b - English & French
Page Count 26
Revision Level 1.0
Supercedes
Committee 47F
Publish Date Document Id Type View
April 1, 2026 IEC 62047-10 Ed. 1.0 b:2011 Revision
July 1, 2011 Revision