IEC 62047-13 Ed. 1.0 b:2012

Current Revision
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

PUBLISH DATE 2012
PAGES 34

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear-type test methods of measuring adhesive strength for MEMS structures.

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.

This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively.

This standard specifies the adhesive testing method for micro-sized elements in order to optimally select materials and processing conditions for MEMS devices.

This standard does not particularly restrict test piece material, test piece size, and performance of the measuring device, since:

  • the materials and size of MEMS device components range widely, and
  • testing machine for micro-sized materials has not been generalized.
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