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IEC 62047-17 Ed. 1.0 b:2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
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IEC 62047-17 Ed. 1.0 b:2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

PUBLISH DATE 2015
PAGES 58
IEC 62047-17 Ed. 1.0 b:2015

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window.

The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 ÎĽ to 10 ÎĽ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm.

The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window.

Elastic modulus and residual stress for the film materials can be determined with this method.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date March 5, 2015
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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