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IEC 62047-42 Ed. 1.0 en:2022

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
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IEC 62047-42 Ed. 1.0 en:2022

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever

PUBLISH DATE 2022
PAGES 26
IEC 62047-42 Ed. 1.0 en:2022

Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever.

IEC 62047-42:2022 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film on microcantilever, which is a typical structure of actual micro sensors and micro actuators.

In order to obtain actual and precise piezoelectric coefficient of the piezoelectric thin films with microdevice structures, this document reports the schema to determine the characteristic parameters for consumer, industry, or any other applications of piezoelectric devices.

This document applies to piezoelectric thin films on microcantilever fabricated by MEMS process.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Sept. 1, 2022
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47F
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