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IEC 62137-1-1 Ed. 1.0 b:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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IEC 62137-1-1 Ed. 1.0 b:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

PUBLISH DATE 2007
PAGES 18
IEC 62137-1-1 Ed. 1.0 b:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components.

The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress.

This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62137
Publication Date July 1, 2007
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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