IEC 62326-4 Ed. 1.0 b:1996

Current Revision
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Best Price Guarantee Dec 1, 1996 EN/FR 1 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

PUBLISH DATE 1996

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made.

Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system.

Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.

Loading...

Failed to load document history.

Publish Date Document Id Type View