IEC 62374-1 Ed. 1.0 b:2010

Current Revision
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

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Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

PUBLISH DATE 2010
PAGES 36

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers.

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

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