IEC 62418 Ed. 1.0 b:2010

Current Revision
Semiconductor devices - Metallization stress void test

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Semiconductor devices - Metallization stress void test

PUBLISH DATE 2010
PAGES 38

Semiconductor devices - Metallization stress void test

IEC 62418:2010 describes a method of metallization stress void test and associated criteria.

It is applicable to aluminium (Al) or copper (Cu) metallization.

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