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IEC 62435-5 Ed. 1.0 b:2017

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
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IEC 62435-5 Ed. 1.0 b:2017

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

PUBLISH DATE 2017
PAGES 46
IEC 62435-5 Ed. 1.0 b:2017

Electronic components - Long-term storage of electronic semiconductor devices

Part 5: Die and wafer devices

IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation.

This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes.

Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62435
Publication Date Jan. 1, 2017
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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