Logo
Login Sign Up
Current Revision

IEC 62739-1 Ed. 1.0 b:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Best Price Guarantee
Instant

$145.53

2-5 Days

$145.53

SAVE 10%

$261.95


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 62739-1 Ed. 1.0 b:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

PUBLISH DATE 2013
PAGES 40
IEC 62739-1 Ed. 1.0 b:2013

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62739
Publication Date June 18, 2013
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Loading...

Failed to load document history.

Publish Date Document Id Type View