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IEC 62878-1 Ed. 1.0 en:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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IEC 62878-1 Ed. 1.0 en:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

PUBLISH DATE 2019
PAGES 24
IEC 62878-1 Ed. 1.0 en:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62878
Publication Date Oct. 1, 2019
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
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