Logo
Login Sign Up
Current Revision

IEC 62878-2-5 Ed. 1.0 en:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
Best Price Guarantee

$423.50

2-5 Days

$423.50

SAVE 10%

$762.30


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 62878-2-5 Ed. 1.0 en:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

PUBLISH DATE 2019
PAGES 58
IEC 62878-2-5 Ed. 1.0 en:2019

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

IEC 62878-2-5:2019(E) specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.

IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62878
Publication Date Sept. 1, 2019
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
Loading...

Failed to load document history.

Publish Date Document Id Type View