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IEC 62878-2-602 Ed. 1.0 b:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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IEC 62878-2-602 Ed. 1.0 b:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

PUBLISH DATE 2021
PAGES 28
IEC 62878-2-602 Ed. 1.0 b:2021
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62878
Publication Date June 1, 2021
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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