IEC 62878-2-602 Ed. 1.0 b:2021

Current Revision
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

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Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

PUBLISH DATE 2021
PAGES 28

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity.

It is applicable to stacked electronic modules.

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