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IEC 62878-2-603 Ed. 1.0 b:2025

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
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IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
SDO IEC: International Electrotechnical Commission
Document Number IEC 62878
Publication Date Not Available
Language b - English & French
Page Count 30
Revision Level 1.0
Supercedes
Committee 91
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