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IEC 62892 Ed. 1.0 b:2019

Extended thermal cycling of PV modules - Test procedure
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IEC 62892 Ed. 1.0 b:2019

Extended thermal cycling of PV modules - Test procedure

PUBLISH DATE 2019
PAGES 38
IEC 62892 Ed. 1.0 b:2019

Extended thermal cycling of PV modules is a test procedure designed to evaluate the durability and reliability of photovoltaic modules under conditions that simulate long-term thermal stress.

The procedure involves subjecting the PV modules to repeated cycles of heating and cooling, which mimic the temperature fluctuations experienced in real-world operating environments.

Key steps in the test procedure include:

  • Defining the temperature range and cycle duration based on relevant standards or specific application needs.
  • Ensuring the modules reach the defined temperature extremes in each cycle.
  • Maintaining the modules at each temperature extreme for a specified dwell time.
  • Repeating the cycles for a predetermined number of times to simulate extended use.

After completing the thermal cycles, modules are inspected and tested for any physical or performance degradation, such as cracks, delamination, or decreased electrical output.

This test procedure helps in understanding the resilience of PV modules and aids manufacturers in improving product quality and longevity.

IEC 62892:2019 defines a test sequence that extends the thermal cycling test of IEC 61215-2. It is intended to differentiate PV modules with improved durability to thermal cycling and evaluate modules for deployment in locations most susceptible to thermal cycling type stress.

This document is based on the ability for 95 % of the modules represented by the samples submitted for this test to pass an equivalency of 500 thermal cycles, as defined in IEC 61215 2:2016, 4.11.3, with a maximum power degradation of less than 5 %. Provisions are also provided to reduce overall test time by increasing the maximum cycle temperature and/or the number of modules submitted for test.

The test procedure in this document was developed based on analysis of the stress on tin-lead solder bonds on crystalline silicon solar cells in a glass superstrate type package. Changes to lead-free solder have an effect on the acceleration factors but not enough to change the overall results of this test.

Monolithic type modules with integral cell interconnection do not suffer from this specific type of stress but there are still electrical connections within the module, for example between the integrated cell circuit and the module bus bars, that may be subject to wear out from thermal cycling.

Flexible modules (without glass) are not stressed in the same way as those with glass superstrates or substrates, therefore use of the equivalency factor employed in this document may not be applicable to these modules.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62892
Publication Date April 1, 2019
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 82
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