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IEC 62899-202-10 Ed. 1.0 en:2023

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
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IEC 62899-202-10 Ed. 1.0 en:2023

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer

PUBLISH DATE 2023
PAGES 30
IEC 62899-202-10 Ed. 1.0 en:2023

Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer.

IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation.

The method measures resistance changes in-situ or post-elongation.

This document is applicable to thermoformable substrates with conductive ink layers.

The thermoformable substrates can have printed graphic ink as well as cover insulation layers.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62899
Publication Date Aug. 1, 2023
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 119
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