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IEC 62899-202-5 Ed. 1.0 en:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
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IEC 62899-202-5 Ed. 1.0 en:2018

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

PUBLISH DATE 2018
PAGES 20
IEC 62899-202-5 Ed. 1.0 en:2018
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

 

SDO IEC: International Electrotechnical Commission
Document Number IEC 62899
Publication Date Sept. 1, 2018
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 119
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