IEC 62899-202-5 Ed. 1.0 en:2018

Current Revision
Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

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Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate

PUBLISH DATE 2018
PAGES 20

Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate.

IEC 62899-202-5:2018(E) specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.

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