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IEC 62899-202-9 Ed. 1.0 en:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
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IEC 62899-202-9 Ed. 1.0 en:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

PUBLISH DATE 2023
PAGES 18
IEC 62899-202-9 Ed. 1.0 en:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation.

Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62899
Publication Date Aug. 1, 2023
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 119
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