IEC 62951-1 Ed. 1.0 en:2017

Current Revision
Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

Best Price Guarantee Apr 1, 2017 English 20 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

PUBLISH DATE 2017
PAGES 20

Semiconductor devices - Flexible and stretchable semiconductor devices

Part 1: Bending test method for conductive thin films on flexible substrates

IEC 62951-1:2017(E) specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates.

Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors.

Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film.

The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate.

The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate.

The bending test methods include outer bending test and inner bending test.

Loading...

Failed to load document history.

Publish Date Document Id Type View