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IEC 62951-4 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
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IEC 62951-4 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices

PUBLISH DATE 2019
PAGES 30
IEC 62951-4 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4:

Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices

IEC 62951-4:2019 specifies an evaluation method of the bending fatigue properties of conductive thin film and flexible substrate for the application at flexible semiconductor devices.

The films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film used for flexible semiconductor devices.

The electrical and mechanical behaviours of films on the substrate are evaluated.

The fatigue test methods include:

  • dynamic bending fatigue test
  • static bending fatigue test
SDO IEC: International Electrotechnical Commission
Document Number IEC 62951
Publication Date Feb. 1, 2019
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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