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IEC 62951-5 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
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IEC 62951-5 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

PUBLISH DATE 2019
PAGES 38
IEC 62951-5 Ed. 1.0 b:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials.

This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use.

The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance.

This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

SDO IEC: International Electrotechnical Commission
Document Number IEC 62951
Publication Date Feb. 1, 2019
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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