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IEC 63055 Ed. 2.0 en:2023

Format for LSI-Package-Board Interoperable design
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International Electrotechnical Commission Logo

IEC 63055 Ed. 2.0 en:2023

Format for LSI-Package-Board Interoperable design

PUBLISH DATE 2023
PAGES 298
IEC 63055 Ed. 2.0 en:2023
Format for LSI-Package-Board Interoperable design
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.
SDO IEC: International Electrotechnical Commission
Document Number IEC 63055
Publication Date Oct. 1, 2023
Language en - English
Page Count 298
Revision Level 2.0
Supercedes
Committee 91
Publish Date Document Id Type View
Oct. 1, 2023 Revision
Oct. 1, 2023 IEC 63055 Ed. 2.0 en:2023 Revision