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IEC 63068-1 Ed. 1.0 en:2019

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
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IEC 63068-1 Ed. 1.0 en:2019

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

PUBLISH DATE 2019
PAGES 28
IEC 63068-1 Ed. 1.0 en:2019
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
IEC 63068-1:2019(E) gives a classification of defects in as-grown 4H-SiC (Silicon Carbide) epitaxial layers. The defects are classified on the basis of their crystallographic structures and recognized by non-destructive detection methods including bright-field OM (optical microscopy), PL (photoluminescence), and XRT (X-ray topography) images.

 

SDO IEC: International Electrotechnical Commission
Document Number IEC 63068
Publication Date Jan. 1, 2019
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47
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