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Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability
Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors
Part 1: Test method for bias temperature instability
IEC 63275-1:2022 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature readout after applying continuous positive gate-source voltage stress at elevated temperature.
The proposed method accepts a certain amount of recovery by allowing large delay times between stress and measurement (up to 10 h).
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