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IEC 63378-2-1 Ed. 1.0 en:2024

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
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IEC 63378-2-1 Ed. 1.0 en:2024

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

IEC 63378-2-1 Ed. 1.0 en:2024
IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.
SDO IEC: International Electrotechnical Commission
Document Number IEC 63378
Publication Date Not Available
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47D
Publish Date Document Id Type View
Not Available IEC 63378-2-1 Ed. 1.0 en:2024 Revision