Logo
Login Sign Up
Current Revision

IEC 63378-3 Ed. 1.0 b:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
Best Price Guarantee
Instant

$100.87

2-5 Days

$100.87

SAVE 10%

$181.57


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 63378-3 Ed. 1.0 b:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

IEC 63378-3 Ed. 1.0 b:2025

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO 243, TO 252 and TO 263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.

This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

SDO IEC: International Electrotechnical Commission
Document Number IEC 63378
Publication Date Not Available
Language b - English & French
Page Count 32
Revision Level 1.0
Supercedes
Committee 47D
Loading...

Failed to load document history.

Publish Date Document Id Type View