Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

Nuclear power plants - Instrumentation and control systems important to safety - Software aspects for computer-based systems performing category B or C functions

Helican-scan digital video cassette recording format using 12,65 mm magnetic tape and incorporating MPEG-4 compression - Type D-16 format

Capacitors for high-voltage alternating current circuit-breakers - Part 1: General and grading capacitors

Capacitors for high voltage alternating current circuit breakers - Part 2: TRV capacitors

Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance

Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator integrated laser diode modules and pump laser diode modules

Fibre optic active components and devices - Package and interface standards - Part 12: Laser transmitters with a coaxial RF connector

Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages

Fibre optic active components and devices - Package and interface standards - Part 16: Transmitter and receiver components for use with LC connector interface

Fibre optic active components and devices - Package and interface standards - Part 17: Transmitter and receiver components with dual coaxial RF connectors

Fiber optic active components and devices - Package and interface standards - Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC connector interface

Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit

Fibre optic active components and devices - Package and interface standards - Part 3: SFF 20-pin transceivers

Fibre optic active components and devices - Package and interface standards - Part 5: SC 1x9 fibre optic modules

Fibre optic active components and devices - Package and interface standards - Part 6: ATM-PON transceivers

Fibre optic active components and devices - Performance standards - Part 1: General and guidance

Fibre optic active components and devices - Performance standards - Part 10: Radio-over-fibre (RoF) transceivers for mobile fronthaul

Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface

Fibre optic active components and devices - Performance standards - Part 12: Distributed feedback laser diode device for analogue radio over fibre systems

Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices