Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 40-Gbit/s fibre optic transmission systems

Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application

Fibre optic active components and devices - Performance standards - Part 5: ATM-PON transceivers with LD driver and CDR ICs

Fibre optic active components and devices - Performance standards - Part 7: 1 310-nm discrete vertical cavity surface emitting laser devices

Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices

Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers

Fibre optic active components and devices - Test and measurement procedures - Part 1: General and guidance

Fibre optic active components and devices - Test and measurement procedures - Part 2: ATM-PON transceivers

Fibre optic active components and devices - Test and measurement procedures - Part 4: Relative intensity noise using a time-domain optical detection system

Fibre optic active components and devices - Test and measurement procedures - Part 5: Wavelength channel tuning time of tuneable transmitters

Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices

Safety of equipment electrically connected to a telecommunication network

Metallic communication cables test methods - Part 1-1: Electrical - Measurement of the pulse/step return loss in the frequency domain using the Inverse Discrete Fourier Transformation (IDFT)

Metallic communication cable test methods - Part 4-10: Electromagnetic compatibility (EMC) - Transfer impedance and screening attenuation of feed-throughs and electromagnetic gaskets - Double coaxial test method

Metallic communication cable test methods - Part 4-11: Electromagnetic compatibility (EMC) - Coupling attenuation or screening attenuation of patch cords, coaxial cable assemblies, pre-connectorized cables - Absorbing clamp method

Metallic communication cable test methods - Part 4-12: Electromagnetic compatibility (EMC) - Coupling attenuation or screening attenuation of connecting hardware - Absorbing clamp method

Metallic communication cable test methods - Part 4-13: Electromagnetic compatibility (EMC) - Coupling attenuation of links and channels (laboratory conditions) - Absorbing clamp method

Metallic communication cable test methods - Part 4-14: Electromagnetic compatibility (EMC) - Coupling attenuation of cable assemblies (Field conditions) absorbing clamp method

Metallic cables and other passive components test methods - Part 4-15: Electromagnetic compatibility (EMC) related test method for measuring transfer impedance and screening attenuation or coupling attenuation with triaxial cell

Metallic cables and other passive components test methods - Part 4-16: Electromagnetic compatibility (EMC) - Extension of the frequency range to higher frequencies for transfer impedance and to lower frequencies for screening attenuation measurements using the triaxial set-up

Metallic cables and other passive components - Test methods - Part 4-17: Electromagnetic compatibility (EMC) - Reduction Factor

Metallic communication cable test methods - Part 4-2: Electromagnetic compatibility (EMC) - Screening and coupling attenuation - Injection clamp method

Metallic communication cable test methods - Part 4-3: Electromagnetic compatibility (EMC) related test method for measuring surface transfer impedance - Triaxial method

Metallic communication cable test methods - Part 4-4: Electromagnetic compatibility (EMC) - Test method for measuring of the screening attenuation as up to and above 3 GHz, triaxial method

Metallic communication cable test methods - Part 4-5: Electromagnetic compatibility (EMC) - Screening or coupling attenuation - Absorbing clamp method