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IEC 62769-101-1 Ed. 3.0 b:2023
Field device Integration (FDI)® - Part 101-1: Profiles - Foundation Fieldbus H1
IEC 62769-101-1 Ed. 3.0 b:2023

Field device Integration (FDI)® - Part 101-1: Profiles - Foundation Fieldbus H1

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IEC 62769-101-2 Ed. 3.0 b:2023
Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE
IEC 62769-101-2 Ed. 3.0 b:2023

Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE

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IEC 62769-102-2 Ed. 1.0 b:2023
Field device integration (FDI®) - Part 102-2: Profiles - EtherNet/IP
IEC 62769-102-2 Ed. 1.0 b:2023

Field device integration (FDI®) - Part 102-2: Profiles - EtherNet/IP

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IEC 62769-103-1 Ed. 3.0 b:2023
Field Device Integration (FDI)® - Part 103-1: Profiles - PROFIBUS
IEC 62769-103-1 Ed. 3.0 b:2023

Field Device Integration (FDI)® - Part 103-1: Profiles - PROFIBUS

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IEC 62769-103-4 Ed. 3.0 b:2023
Field Device Integration (FDI)® - Part 103-4: PROFINET
IEC 62769-103-4 Ed. 3.0 b:2023

Field Device Integration (FDI)® - Part 103-4: PROFINET

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IEC 62769-109-1 Ed. 3.0 b:2023
Field device integration (FDI)® - Part 109-1: Profiles - HART® and WirelessHART®
IEC 62769-109-1 Ed. 3.0 b:2023

Field device integration (FDI)® - Part 109-1: Profiles - HART® and WirelessHART®

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IEC 62769-115-2 Ed. 1.0 b:2020
Field device integration (FDI) - Part 115-2: Profiles - Modbus-RTU
IEC 62769-115-2 Ed. 1.0 b:2020

Field device integration (FDI) - Part 115-2: Profiles - Modbus-RTU

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IEC 62769-150-1 Ed. 2.0 b:2023
Field device integration (FDI)® - Part 150-1: Profiles - ISA100
IEC 62769-150-1 Ed. 2.0 b:2023

Field device integration (FDI)® - Part 150-1: Profiles - ISA100

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IEC 62769-151-1 Ed. 1.0 b:2023
Field device integration (FDI®) - Part 151-1: Profiles - OPC UA
IEC 62769-151-1 Ed. 1.0 b:2023

Field device integration (FDI®) - Part 151-1: Profiles - OPC UA

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IEC 62769-2 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 2: Client
IEC 62769-2 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 2: Client

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IEC 62769-3 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 3: Server
IEC 62769-3 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 3: Server

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IEC 62769-4 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 4: FDI Packages
IEC 62769-4 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 4: FDI Packages

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IEC 62769-5 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 5: FDI Information Model
IEC 62769-5 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 5: FDI Information Model

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IEC 62769-6 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 6: FDI Technology Mappings
IEC 62769-6 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 6: FDI Technology Mappings

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IEC 62769-6-100 Ed. 1.0 b:2023
Field Device Integration (FDI®) - Part 6-100: Technology Mapping - .Net
IEC 62769-6-100 Ed. 1.0 b:2023

Field Device Integration (FDI®) - Part 6-100: Technology Mapping - .Net

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IEC 62769-6-200 Ed. 1.0 b:2023
Field Device Integration (FDI®) - Part 6-200: Technology Mapping - HTML5
IEC 62769-6-200 Ed. 1.0 b:2023

Field Device Integration (FDI®) - Part 6-200: Technology Mapping - HTML5

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IEC 62769-7 Ed. 3.0 b:2023
Field Device Integration (FDI®) - Part 7: Communication Devices
IEC 62769-7 Ed. 3.0 b:2023

Field Device Integration (FDI®) - Part 7: Communication Devices

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IEC 62769-8 Ed. 1.0 b:2023
Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping
IEC 62769-8 Ed. 1.0 b:2023

Field device integration (FDI®) - Part 8:EDD to OPC-UA Mapping

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IEC 62770 Ed. 2.0 b:2024
Fluids for electrotechnical applications - Unused natural esters for transformers and similar electrical equipment
IEC 62770 Ed. 2.0 b:2024

Fluids for electrotechnical applications - Unused natural esters for transformers and similar electrical equipment

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IEC 62772 Ed. 2.0 b:2023
Composite hollow core station post insulators with a.c. voltage greater than 1 000 V and d.c. voltage greater than 1 500 V - Definitions, test methods and acceptance criteria
IEC 62772 Ed. 2.0 b:2023

Composite hollow core station post insulators with a.c. voltage greater than 1 000 V and d.c. voltage greater than 1 500 V - Definitions, test methods and acceptance criteria

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IEC 62776 Ed. 1.0 b:2014
Double-capped LED lamps designed to retrofit linear fluorescent lamps - Safety specifications
IEC 62776 Ed. 1.0 b:2014

Double-capped LED lamps designed to retrofit linear fluorescent lamps - Safety specifications

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IEC 62777 Ed. 1.0 en:2016
Quality evaluation method for the sound field of directional loudspeaker array system
IEC 62777 Ed. 1.0 en:2016

Quality evaluation method for the sound field of directional loudspeaker array system

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IEC 62779-1 Ed. 1.0 b:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
IEC 62779-1 Ed. 1.0 b:2016

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

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IEC 62779-2 Ed. 1.0 b:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
IEC 62779-2 Ed. 1.0 b:2016

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances

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IEC 62779-3 Ed. 1.0 b:2016
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
IEC 62779-3 Ed. 1.0 b:2016

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions

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