Logo
Login Sign Up
Current Revision

IEC/TR 60286-7 Ed. 1.0 b:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
Best Price Guarantee

$100.87

2-5 Days

$100.87

SAVE 10%

$181.57


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC/TR 60286-7 Ed. 1.0 b:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components

PUBLISH DATE 2019
IEC/TR 60286-7 Ed. 1.0 b:2019

Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components.

IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller.

It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 60286
Publication Date Oct. 1, 2019
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 40
Loading...

Failed to load document history.

Publish Date Document Id Type View