Logo
Login Sign Up
Current Revision

IEC/TR 61191-7 Ed. 1.0 en:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies
Best Price Guarantee

$512.05

2-5 Days

$512.05

SAVE 10%

$921.69


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC/TR 61191-7 Ed. 1.0 en:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

PUBLISH DATE 2020
IEC/TR 61191-7 Ed. 1.0 en:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information on how technical cleanliness can be assessed within the electronics assembly industry.

Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 61191
Publication Date March 1, 2020
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
Loading...

Failed to load document history.

Publish Date Document Id Type View