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IEC/TR 61760-3-1 Ed. 1.0 en:2022

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
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IEC/TR 61760-3-1 Ed. 1.0 en:2022

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

PUBLISH DATE 2022
IEC/TR 61760-3-1 Ed. 1.0 en:2022

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering

Guidelines for through hole diameter design with solder paste surface printing method

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 61760
Publication Date June 1, 2022
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
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