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IEC/TR 62866 Ed. 1.0 b:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
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IEC/TR 62866 Ed. 1.0 b:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

PUBLISH DATE 2014
IEC/TR 62866 Ed. 1.0 b:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 62866
Publication Date May 7, 2014
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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