IEC/TR 62878-2-7 Ed. 1.0 en:2019

Current Revision
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

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Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

PUBLISH DATE 2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards.

It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards.

These boards are mainly for mobile devices.

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