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IEC/TR 62878-2-7 Ed. 1.0 en:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
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IEC/TR 62878-2-7 Ed. 1.0 en:2019

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

PUBLISH DATE 2019
IEC/TR 62878-2-7 Ed. 1.0 en:2019
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 62878
Publication Date March 1, 2019
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
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