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IEC/TR 63357 Ed. 1.0 en:2022

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
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IEC/TR 63357 Ed. 1.0 en:2022

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

PUBLISH DATE 2022
IEC/TR 63357 Ed. 1.0 en:2022

Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles

IEC TR 63357:2022(E) describes the standardization roadmap of fault test methods for integrated circuits used in automotive vehicles.

Since automotive vehicles are exposed to a harsh environment such as very low or high temperature, vibration, high frequency signals, etc., they are tested for possible faults which can be caused by these harsh conditions.

There are several fault test methods and related issues to be standardized.

Semiconductor devices used in automotive vehicles are exposed to a harsh environment of very high or very low temperature, vibration, high frequency signals, etc.

Therefore, they are tested for possible faults which can be caused by the harsh environment.

Evaluation results following these fault test methods will provide the robustness of the semiconductor device.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 63357
Publication Date Oct. 1, 2022
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47
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