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Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
IEC TR 63357:2022(E) describes the standardization roadmap of fault test methods for integrated circuits used in automotive vehicles.
Since automotive vehicles are exposed to a harsh environment such as very low or high temperature, vibration, high frequency signals, etc., they are tested for possible faults which can be caused by these harsh conditions.
There are several fault test methods and related issues to be standardized.
Semiconductor devices used in automotive vehicles are exposed to a harsh environment of very high or very low temperature, vibration, high frequency signals, etc.
Therefore, they are tested for possible faults which can be caused by the harsh environment.
Evaluation results following these fault test methods will provide the robustness of the semiconductor device.
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