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IEC/TR 63378-1 Ed. 1.0 en:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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IEC/TR 63378-1 Ed. 1.0 en:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

PUBLISH DATE 2021
IEC/TR 63378-1 Ed. 1.0 en:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages.

IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages.

It also provides guidelines to use these thermal characteristics.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TR 63378
Publication Date Dec. 1, 2021
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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