Logo
Login Sign Up
Current Revision

IEC/TS 61189-3-301 Ed. 1.0 en:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
Best Price Guarantee

$131.00

2-5 Days

$131.00

SAVE 10%

$235.80


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC/TS 61189-3-301 Ed. 1.0 en:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

PUBLISH DATE 2026
IEC/TS 61189-3-301 Ed. 1.0 en:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nickel and copper plating in PWBs.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 61189
Publication Date April 1, 2026
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC/TS 61189-3-301 Ed. 1.0 en:2016 Revision
June 5, 2024 Revision