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IEC/TS 61189-3-301 Ed. 1.0 en:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
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IEC/TS 61189-3-301 Ed. 1.0 en:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB

PUBLISH DATE 2016
IEC/TS 61189-3-301 Ed. 1.0 en:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards)

Appearance inspection method for plated surfaces on PWB

IEC TS 61189-3-301:2016(E) outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs).

The method is applicable to gold, nickel and copper plating in PWBs.

SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 61189
Publication Date July 1, 2016
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
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