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IEC/TS 62878-2-3 Ed. 1.0 b:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide
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International Electrotechnical Commission Logo

IEC/TS 62878-2-3 Ed. 1.0 b:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

PUBLISH DATE 2015
IEC/TS 62878-2-3 Ed. 1.0 b:2015
Device embedded substrate - Part 2-3: Guidelines - Design guide
IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
SDO IEC: International Electrotechnical Commission
Document Number IEC/TS 62878
Publication Date March 27, 2015
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
June 5, 2024 Revision
March 27, 2015 IEC/TS 62878-2-3 Ed. 1.0 b:2015 Revision