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IPC-TR-1

An Introduction to Tape Automated Bonding Fine Pitch Technology
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IPC-TR-1

An Introduction to Tape Automated Bonding Fine Pitch Technology

PUBLISH DATE 2006
IPC-TR-1
An Introduction to Tape Automated Bonding Fine Pitch Technology - Single User Download
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT. 54 pages. Released by the Surface Mount Council January 1989.
SDO IPC: IPC by Global Electronics Association
Document Number 1
Publication Date Jan. 1, 2006
Language en - English
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Revision Level 0
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Jan. 1, 2006 IPC-TR-1 Revision