IPC-2225

Current Revision
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

PUBLISH DATE 1998
IPC-2225
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
Used in conjunction with IPC-2221A, IPC-2225 establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties and relationships with DFM and DFE. 44 pages. Released May 1998.
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