Logo
Login Sign Up
Current Revision

IPC-2251

Design Guide for the Packaging of High Speed Electronic Circuit
Best Price Guarantee
Instant

$155.00

2-5 Days

$191.00

SAVE 10%

$311.40


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
IPC by Global Electronics Association Logo

IPC-2251

Design Guide for the Packaging of High Speed Electronic Circuit

PUBLISH DATE 2003
IPC-2251
Design Guide for the Packaging of High Speed Electronic Circuit
This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions. 99 pages. Released November 2003.
SDO IPC: IPC by Global Electronics Association
Document Number 2251
Publication Date Nov. 1, 2003
Language en - English
Page Count 100
Revision Level 0
Supercedes
Committee
Loading...

Failed to load document history.

Publish Date Document Id Type View