Logo
Login Sign Up
Current Revision

IPC-4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Best Price Guarantee
Instant

$129.00

2-5 Days

$151.00

SAVE 10%

$252.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
IPC by Global Electronics Association Logo

IPC-4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

PUBLISH DATE 2022
IPC-4555
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555
SDO IPC: IPC by Global Electronics Association
Document Number 4555
Publication Date April 1, 2022
Language en - English
Page Count
Revision Level 0
Supercedes
Committee
Publish Date Document Id Type View
April 1, 2022 IPC-4555 Revision